Herbert

Oetzlinger

Semsysco GmbH

CEO

Herbert Oetzlinger , graduated HTL Braunau 1987 in high power electronics/ electrotechnics, Herbert worked in the Semiconductor industry for 30+ years, focused on wet processing . Special focus on advanced packaging in electroplating and wet etching/cleaning of wafers and substrates. For many years he was VP of Sales with Semitool Inc, where he excelled with his in-depth knowledge of process and hardware. During this time, Herbert worked with many worldwide leading companies on Fan-out, E-WLB and other new developments in wafer level advanced packaging. In 2012, he founded Semsysco GmbH and is also heading the company as CEO. Semsysco is a world leader in high speed electrochemical deposition with a pedigree and expertise in all-around wet processing for wafer and panel level.

Herbert Oetzlinger , graduated HTL Braunau 1987 in high power electronics/ electrotechnics, Herbert worked in the Semiconductor industry for 30+ years, focused on wet processing . Special focus on advanced packaging in electroplating and wet etching/cleaning of wafers and substrates. For many years he was VP of Sales with Semitool Inc, where he excelled with his in-depth knowledge of process and hardware. During this time, Herbert worked with many worldwide leading companies on Fan-out, E-WLB and other new developments in wafer level advanced packaging. In 2012, he founded Semsysco GmbH and is also heading the company as CEO. Semsysco is a world leader in high speed electrochemical deposition with a pedigree and expertise in all-around wet processing for wafer and panel level.

Upcoming Events

May 9th

 | 

16:40 - 17:00

16:40 - 17:00

Focal points to consider that drive the CoO for wet processing PLP technology.

Currently there are three different industries are going after the advanced Panel Level Packaging (PLP) market. These are: the PCB producers, the (wafer) OSAT’s and the display industry with their obsolete production lines. Because of this, the variety of different panel sizes, materials and thicknesses is larger than all wafer varieties together. In order to decrease cost and increase efficiency, standardisation is desperately needed. Advanced PLP requires wafer level process performance such as precision, uniformity, foreign particle free processing all of which ultimately leads to necessary yield levels. This presentation tries to point out how to reduce capex and running cost on the equipment and process side and how to achieve wafer level process performance and cost on panels.

Semsysco GmbH

SEMSYSCO provides wet processing solutions for the semiconductor and related industry. The tools enable single and batch wafer as well as large flat panel processing.

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