US ISES Speakers

US ISES 2023 Speakers TBD
View 2022 Speakers Here

US ISES 2022 Speakers

Our global events and conferences for the semiconductor and MEMS & Sensors manufacturing and supply industry, bring together political, business, financial, research and industry leaders and decision makers all under one roof. 2023 Speakers TBA

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Industry Topics
Advanced Packaging
Artificial Intelligence
Memory Manufacturing
5G Networking
Supply Chain
Automotive Electronics
Mark Fuselier

AMD

SVP
Technology & Product Engineering

Dr. Ann Kelleher

Intel Corporation

EVP, GM
Technology Development

Babak Sabi Ph.D.

Intel Corporation

SVP, GM
Assembly & Test Technology Development 

Chidi Chidambaram

Qualcomm

VP
Engineering

Thomas Sonderman

SkyWater Technology

President, CEO

Sonny Banwari

Advantest

VP
Global Business Development and Operations at Advantest Cloud Solutions

Ben Kozy

Airspace

COO

Ryan Rusnak

Airspace

CTO, Co-Founder

Dr. Deepak Kulkarni

AMD

Fellow
Advanced Packaging

Dr. Ajay Satu

Amkor Technology, Inc.

Director
Automotive Product Marketing

Curtis Zwenger

Amkor Technology, Inc.

VP
Advanced SiP Product Development

Rebeca Jimenez

Amkor Technology, Inc.

Corporate VP
Advanced SiP Business Unit

Jennifer Zhao

ams OSRAM

EVP, GM
Advanced Optical Sensors Division

Ruurd Boomsma

Besi

CTO

Scott Balaguer

Edwards Vacuum

VP, GM
Edwards North America

Dr. Maillik Tatipamula

Ericsson

CTO

Sanjeev Aggarwal

Everspin Technologies, Inc

President and CEO

Amy Leong

Formfactor

CMO, SVP, GM
Mergers & Acquisitions

Dr. Mike Slessor

Formfactor

President, CEO

Prof. Rao Tummala

Georgia Tech University

Distinguished and Endowed Chair Professor & Director Emeritus

Christine Dunbar

GlobalFoundries

VP
Product Management CWI Business Unit

Dr. John Pellerin

GlobalFoundries

VP, Chief Technologist

Dr. Amit Marathe

Google

Engineering Head
SoC/Module Technology & Reliability

Chris Camacho

GPEC

President, CEO

Mario Morales

IDC

Group VP
Enabling Technologies and Semiconductors

Dr. Shekhar Chandrashekhar

iNEMI

CEO

Jackie Sturm

Intel Corporation

CVP
Global Supply Chain Operations

Oreste Donzella

KLA Corporation

EVP
Electronics, Packaging and Components

Chee-Ping Lee

Lam Research

Technical Director
Advanced Packaging Customer Operations

Dr. Raghu Chaware

Lattice Semiconductor

Sr. Director
Assembly & Packaging

Dr. Ron Ho

Meta

Sr. Director
Silicon Engineering

Thy Tran

Micron Technology

VP
DRAM Process Integration

Dr. Sandy Vos

NXP Semiconductors

R&D Director
MEMS Sensors

Keith Best

Onto Innovation

Director
Product Marketing

David McCann

Rockley Photonics

VP
Packaging

Dr. Dae-Woo Kim

Samsung Electronics

Corporate VP
Head of PKG TD Team

Herbert Oetzlinger

Semsysco GmbH

CEO

Tony LoBianco

Skyworks Solutions, Inc.

Head
Global Packaging

Dr. Yun Zhang

Shinhao Materials LLC

Founder, CEO

Steve Alsbro

Solidigm Technology

VP
Supply Chain & Procurement

Dr. Milena Vujosevic

TDK

VP
MEMS Packaging Technology Development

Ben Rathsack

TEL America

VP
TEA Product Business Unit and Technology Development Group

Maitreyee Mahajani

Western Digital

VP
Fab Operations